High Density H3C Server R5500 G6 8 GPU AI Training With 8x H200/H100 GPU 24x3.84TB NVMe SSD And Dual Xeon 8558+/8468 Processors
Product Details
| Product Name: | H3C R5500 G6 | Pcie Slots: | 18 × PCIe 3.0 FH Standard Slots |
|---|---|---|---|
| Pbox Switching: | 598Gbps | Processor Speed: | 3.5 GHz |
| Storagetype: | SAS/SATA/NVMe SSD/HDD | Hard Drive: | 3.5TB HDD |
| Cpu: | 1 Core, 800MHz | Equipment Condition: | New |
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Product Description
The H3C UniServer R5500 G6 is a flagship 6U high-density 8-GPU AI training server purpose-built for large-scale generative AI model training, trillion-parameter model fine-tuning, high-performance computing (HPC), and enterprise-level massive data processing. Adopting H3C’s exclusive modular intelligent computing architecture, this server delivers ultra-high parallel computing efficiency, industry-leading local storage capacity, and flexible hardware compatibility, standing out from conventional AI servers with superior scalability and operational reliability. It is fully optimized to tackle the most demanding heavy-load AI workloads for data centers, scientific research institutions, and enterprise intelligent computing platforms.
This fully configured system supports dual Intel Xeon 8558+ / 8468 scalable processors for flexible CPU performance matching, paired with 32x64GB high-speed DDR5 ECC memory to ensure ultra-large dataset real-time processing and multi-task concurrency. It is equipped with a massive 24x3.84TB NVMe high-speed storage array, breaking the local storage bottleneck of most standard AI servers. Compatible with 8x NVIDIA H200 or H100 flagship GPUs with full high-speed interconnection, and integrated with OCP 3.0 high-efficiency expansion interface, this machine achieves comprehensive upgrades in computing power, storage capacity, expansion flexibility and operational stability, perfectly adapting to long-duration distributed AI training and high-concurrency inference scenarios.
| Specification | Details |
| Model Number | H3C UniServer R5500 G6 AI Training Server |
| Form Factor | 6U Standard Rackmount High-Density AI Server |
| Processor | 2x Intel Xeon 8558+ / 8468 Scalable Processors (Dual CPU Optional Configuration) |
| System Memory | 32x 64GB High-Speed DDR5 ECC Registered RAM |
| Storage Configuration | 24x 3.84TB Enterprise-Grade High-Speed NVMe SSD (Ultra-large Local Storage Array) |
| GPU Configuration | 8x NVIDIA H200 / H100 SXM5 High-Performance GPU Accelerators (Dual GPU Generation Compatible) |
| Expansion Interface | OCP 3.0 High-Speed Expansion Interface, Supports Flexible Network & Acceleration Module Upgrade |
| Cooling System | Intelligent Independent Modular Cooling System, Optimized for Long-Term 8-GPU Full-Load AI Training |
| Power Supply | Hot-Swappable Redundant High-Power Power Module, 24/7 Uninterrupted Heavy-Duty Operation |
| Management System | H3C Intelligent Remote Management System, Real-Time Hardware Monitoring & Fault Alarm |
| Core Application | Large LLM Training & Fine-Tuning, Generative AI Inference, HPC Scientific Simulation, AIGC Industry Application, Massive Big Data Analysis, Cloud AI Cluster Deployment |
| Comparison Item | H3C R5500 G6 AI Server | Conventional 8U AI Servers |
| Computing Compatibility | Dual CPU & dual GPU generation compatible, supports Xeon 8558+/8468 and H200/H100 cross configuration, flexible performance matching for diverse AI tasks | Fixed single CPU and single GPU specification, poor compatibility, unable to flexibly switch training and inference workloads |
| Storage Capability | Industry-leading 24x3.84TB NVMe ultra-large local storage array, eliminates external storage reliance, drastically reduces data transmission latency | Limited NVMe storage bays, small local capacity, heavily dependent on external storage clusters, causing obvious training latency bottlenecks |
| Expansion Flexibility | Built-in OCP 3.0 high-speed interface, supports high-performance network cards and AI acceleration module upgrades, future-proof for iterative AI workloads | Single traditional PCIe expansion, lack of dedicated high-speed OCP interface, insufficient scalability for new-generation AI networks |
| Maintenance & Stability | Modular hot-swappable design for GPU, CPU, storage, fan and power modules, fast maintenance, zero downtime for cluster operation | Integrated fixed structure, complicated disassembly and maintenance, high risk of cluster operation interruption |
| Space & Heat Dissipation | Compact 6U high-density layout, optimized dedicated cooling for multi-GPU full load, higher rack space utilization than traditional 8U models | Bulky 8U structure with low space efficiency, ordinary cooling design leading to GPU thermal throttling under long full load |
| Accessory Name | Functional Description |
| High-Speed OCP 3.0 Network Card | Upgrade network transmission speed, adapt to large-scale AI cluster distributed training and data synchronization |
| Extended DDR5 Memory Module | Expand system memory capacity to support larger model training and higher concurrent inference tasks |
| High-Performance NVMe SSD | Further expand local storage space to support ultra-large-scale AI dataset local deployment |
| Redundant Backup Power Supply | Strengthen power supply redundancy to ensure stable operation of multi-GPU heavy-load AI training for 24/7 |
- Dual Compatibility & Flexible Configuration: Supports dual Intel Xeon CPU generations and H200/H100 dual flagship GPU adaptation, freely matching lightweight inference and ultra-heavy large model training tasks with strong scenario adaptability
- Industry-Leading Massive Local Storage: Equipped with 24x3.84TB NVMe high-speed storage array, realizing ultra-large dataset local storage, avoiding cross-network data transmission delay, greatly improving AI training efficiency
- OCP 3.0 High-Speed Expandability: Dedicated OCP 3.0 high-efficiency expansion interface reserves abundant upgrade space for high-speed networking and AI acceleration, perfectly adapting to iterative upgrades of new-generation AI technologies
- High-Density & Efficient Heat Dissipation: Advanced 6U compact high-density design saves data center rack space, while customized intelligent modular cooling completely solves heat dissipation bottlenecks of 8-GPU long-term full-load operation
- Modular High Reliability Design: Five core modules support independent hot-swappable maintenance, effectively reducing equipment failure downtime and maintenance costs, ensuring long-term stable operation of AI computing clusters
- Powerful Full-Load Computing Performance: Dual high-end CPUs + 8 flagship GPUs + ultra-large memory and storage combination deliver explosive parallel computing power, specially optimized for trillion-parameter LLM training, AIGC generation, scientific HPC simulation and big data intelligent analysis
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Product Highlights
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