ASUS RS723Q-E11-RS24: 4 Dual-Socket Nodes, 8 Processors, 350W TDP per CPU, and 4TB Memory per Node in 2U

ASUS RS723Q-E11-RS24: 2U4N High-Density Server with Direct Liquid Cooling

Product Overview

The ASUS RS723Q-E11-RS24 is a high-density 2U4N (four independent nodes in 2U chassis) rack server powered by 5th Gen Intel Xeon Scalable processors (Emerald Rapids), designed specifically for direct-to-chip liquid cooling solutions . This server is optimized for high-performance computing (HPC), AI inference and training, cloud computing, virtualization, and scale-out infrastructure deployments.

The 2U4N form factor enables four independent dual-socket server nodes within a standard 2U chassis, dramatically increasing compute density while the integrated liquid cooling solution supports higher TDP processors and improves data center power efficiency .

Key Performance Capabilities

Next-Generation Intel Xeon 5th Gen Scalable Processor Architecture

Each node harnesses the power of dual 5th Gen Intel Xeon Scalable processors (Emerald Rapids) with dedicated liquid cooling support :

• Dual 5th Gen Intel Xeon Scalable processors per node (LGA 4677 socket)

• Liquid cooling support: Up to 350W TDP per processor

• UPI interconnect: 16 GT/s for high-speed inter-socket communication

• Core logic: Intel C741 chipset per node

• Performance: Up to 21% greater general-purpose performance per watt compared to previous generation, with significant improvements in AI inference and training

High-Performance DDR5 Memory Architecture (Per Node)

Flexible Storage Configuration

The RS723Q-E11-RS24 offers exceptional storage scalability across four nodes :

PCIe 5.0 Expansion (Per Node)

Each node provides dedicated high-speed expansion capabilities :

Networking (Per Node)

Graphics and Management

• Integrated Graphics: ASPEED AST2600 with 64MB VRAM per node

• Remote Management: Onboard ASUS ASMB11-iKVM for KVM-over-IP

• Management Software: ASUS Control Center Enterprise IT management software

• Redfish API Support: For automated data center management

• Security: Hardware-level Root-of-Trust solution

Direct Liquid Cooling (DLC) Solution

The RS723Q-E11-RS24 is purpose-built for direct-to-chip liquid cooling integration :

• Higher TDP Support: Enables deployment of 350W processors that would be thermally limited with air cooling

• Improved PUE: Liquid cooling reduces Power Usage Effectiveness, lowering data center operational costs

• Higher Power Density: Allows more compute capacity per rack

• Faster Thermal Response: Direct-to-chip cooling controls temperatures more rapidly and efficiently than traditional methods

• Fully Designed for Integration: Includes CPU cold plate compatibility and optimized internal layout for cooling infrastructure

Important Note: The server is fully designed for liquid cooling installation. For configurations requiring air cooling, contact ASUS for thermal solution options and specific system optimization .

System-Wide Features

High Power Efficiency

• Power Supplies: 1+1 redundant Titanium power supplies

• Power Options:

  • 3000W or 3600W 80 PLUS Titanium (220-240V AC)

• Note: 1+1 redundant mode only supports CPUs under 205W in that specific configuration

Physical Specifications

Operating Environment

Key Applications

High-Performance Computing (HPC)

With four dual-processor nodes in 2U (up to 8 processors total), and support for 350W TDP processors via liquid cooling, the RS723Q-E11-RS24 delivers exceptional compute density for HPC clusters, scientific simulations, and research computing environments .

Scale-Out Infrastructure

The 2U4N architecture with flexible storage (8 NVMe + 16 SAS/SATA per chassis) is ideal for scale-out deployments in cloud and enterprise data centers .

AI Inference and Training

5th Gen Intel Xeon processors deliver up to 21% better performance per watt for AI workloads, making this server well-suited for AI inference at scale .

Virtualization and Cloud

High core density per rack unit enables maximum VM density for cloud service providers and enterprise virtualization environments.

Electronic Design Automation (EDA)

Memory-intensive EDA workloads benefit from up to 4TB per node (16 DIMMs) and high-speed DDR5-5600 memory .

Detailed Technical Specifications

Why Choose ASUS RS723Q-E11-RS24?

Conclusion

The ASUS RS723Q-E11-RS24 represents a breakthrough in high-density 2U4N server design, combining four independent dual-socket nodes with 5th Gen Intel Xeon Scalable processors (up to 350W TDP with liquid cooling), 16 DDR5 DIMMs per node (up to 4TB), flexible storage (24 drive bays, 8 NVMe total), and PCIe 5.0 expansion.

With its purpose-built direct-to-chip liquid cooling solution enabling higher processor TDP, scale-out infrastructure design (eight processors, 16 memory channels, 24 drives in 2U), enterprise-grade management (ASMB11-iKVM with AST2600, ASUS Control Center), and hardware-level Root-of-Trust security, this server delivers exceptional performance density for HPC, AI training/inference, cloud, virtualization, and scale-out data center workloads.

Backed by 80 PLUS Titanium redundant power supplies and ASUS's proven server reliability, the RS723Q-E11-RS24 is the ideal choice for organizations seeking to maximize compute density, power efficiency, and operational simplicity in modern data center environments.